Intel's new plant codenamed D1X in Hillsboro, Oregon has been confirmed by Intel will be ready to produce 450 millimeter wafers.
Intel is supposedly sticking with 300mm wafers for a while but will have all the necessary preparations to start 450mm production once the industry is ready for it. The 450mm shift promises to be more efficient and cut costs by allowing more chips to produced at once but it will most likely be a few years before the benefits of this are shown.
One analyst suspects it could be 2018 at the earliest before 450mm fabrication tools are ready.
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