Fab plant TSMC (Taiwan Semiconductor Manufacturing Company) has issued an announcement today that confirms their much anticipated 28nm process tech to now be in volume production, with production wafers having already been shipped to customers at this point.

TSMC's 28nm manufacturing process comprises the following segments; 28nm High Performance (28HP), 28nm High Performance Low Power (28HPL), and 28nm Low Power (28LP), with there also being 28nm High Performance Mobile Computing (28HPM) volume production before the end of the year.

TSMC's Senior Vice President Jason Chen had the following to say during todays announcement:-

Being the first to 28nm volume production demonstrates TSMC's leadership in technology and brings great value to our customers through design wins with competitive products.

The company has said that its 28nm process after already gaining more than 80 customer product tape-outs has managed to surpass 40nm production ramps and product yield. It is expected that the first 28nm chips will start floating about toward the end of the year. But realistically there won't be any 28nm GPUs until at least a couple months into 2012.