When traveling overseas, finding an LTE network that is compatible with your device can be a major hassle, and oftentimes, impossible. Qualcomm has just announced that they have solved the global LTE dilemma.
Dubbed the RF360, Qualcomm's new LTE radio chip is the world's first truly global LTE silicon. It sports connectivity for LTE-FDD, LTE-TDD, WCDMA, EV-DO, CDMA 1x, TD-SCDMA and GSM / EDGE. Qualcomm also says the chip has features that allow manufacturers to develop thinner products that have improved antenna performance, battery life and connection reliability.
Also being shown off was the WTR1625L chip, which is the industry's first component that features carrier aggregation alongside international LTE compatibility. We will have to wait several more months before we begin to see any hardware sporting either of the new chips, and no mention was made of partnerships with handset manufacturers that might utilize the new hardware.
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