Yesterday Kingmax let us know about the release of their 1GB DDR-333 SO-DIMM notebook memory. Kingmax were able to achieve this feat by using their new Stacked IC TinyBGA method of stacking as many chips into as smallest place as possible, as described below.

Kingmax, renowned for its stable product quality, leading specification and high performance on the SO-DIMM market, boosts the memory capacity of SO-DIMM to 1GB inside a limited space with its Stacked TinyBGA IC, a breakthrough of traditional IC chip package technology, and its existing TinyBGA package technology. This revolutionary product will certainly bring a commotion to the SO-DIMM market and meet NB PC users' critical requirement on performance.

 

Unlike the static growth rate of DT PC, the growth rate of NB PC still remains 2-digit growth in terms of shipment recently. On the other hand, mature manufacturing technologies cause the declining prices of NB PC. It is very obvious that the situation of market demand for NB PC has replaced that of DT PC. The wireless and mobile network concept of Intel Centrino CPU incites individuals and SOHO users' needs for mobility and further the new generation Intel P4 CPU has significantly enhanced its functions while the latest Intel 845/855 chip set all can support 2 GB memory capacity. These new designs make no function difference between NB PC and DT PC, and further provide both mobility and platform performance option to performance demanding consumers.