OCZ are taking memory heatsink cooling to the next level with the unveiling today of some new upcoming heatsinks dubbed "Flexipipe", they are based around a heatpipe which transfers heat from the module to another heatsink 1cm above the memory bank, allowing air to pass around the heatsink more freely (or so they say). They'll eventually debut on OCZ's XTC modules as early as next month sometime.
More information on them can be sourced over at The Dailytech.
OCZ Technology today announced its newest memory designs behind closed doors. The design, currently codenamed Flexpipe, will make an appearance on high-end OCZ XTC as early as February 2007.
The design of the Flexpipe heatsink revolves around a heatpipe that transfers heat from the module to another heatsink one centimeter above the memory bank. Air can pass freely under and over the heatsink bank -- an approach that allows air to move over the heatsinks of multiple modules when installed on a motherboard.
The new memory design just finished its pre-production trials and the company will move into test trial phases this month.
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